Production systems for innovative and high-precision die bonding
With automation systems from Häcker Automation, you have the equipment for the various types of die bonding applications.
Increasing miniaturization is quickly pushing traditional chip connections to their limits. From classic die bonding to thermocompression bonding to ultrasonic bonding, the possibilities are diverse and always tailored to your specific application. Our experts will be happy to advise you!
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Do you want to learn more about Die Bonding and our services? Do you need information on a specific topic? Or do you have an individual question? Then don't hesitate to contact us.