With the patented direct dispensing technology, it is possible to apply media such as adhesive directly to the underside of the component with a defined layer height evenly and flat. The direct dispensing unit developed for this purpose provides a reservoir of the desired dispensing material, into which the component is immersed immediately prior to assembly. In addition to uniform wetting, this process allows certain patterns (crosses, dots, ...) to be applied to the component using flexibly definable templates.
This method is often used in die-bonding processes and flip-chip processes.