Direct dispensing
Dispensing directly on the underside of the component
Increase the efficiency of your dispensing processes with production systems from Häcker Automation.

With the patented direct dispensing technology, it is possible to apply media such as adhesive directly to the underside of the component with a defined layer height evenly and flat. The direct dispensing unit developed for this purpose provides a reservoir of the desired dispensing material, into which the component is immersed immediately prior to assembly. In addition to uniform wetting, this process allows certain patterns (crosses, dots, ...) to be applied to the component using flexibly definable templates.
This method is often used in die-bonding processes and flip-chip processes.
further dispensing technologies.
further dispensing technologies.

Our experts will be happy to advise you on this technology.
Microbassembly shop direct Dispensing.
Find everything for your efficient automation in the micro-assembly shop. A large portfolio of machines and modules is available for your production.
to the shopWebinar
STABILITY for Dispensing Applications IN MICRO-ASSEMBLY.
Do you require more facts and figures about this topic?
Webinar on YouTube