Direct dispensing

Dispensing directly on the underside of the component

Increase the efficiency of your dispensing processes with production systems from Häcker Automation.

With the patented direct dispensing technology, it is possible to apply media such as adhesive directly to the underside of the component with a defined layer height evenly and flat. The direct dispensing unit developed for this purpose provides a reservoir of the desired dispensing material, into which the component is immersed immediately prior to assembly. In addition to uniform wetting, this process allows certain patterns (crosses, dots, ...) to be applied to the component using flexibly definable templates.
This method is often used in die-bonding processes and flip-chip processes.



Process stability when dispensing in micro-assembly

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Process stability when dispensing in micro-assembly

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Our experts will be happy to advise you on this technology.

Microbassembly shop direct Dispensing.

Find everything for your efficient automation in the micro-assembly shop. A large portfolio of machines and modules is available for your production.

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OurPlant Pocket

Modular Machine Concept

The compact OurPlant Pocket realises semi-automated processes and provides developers an excellent support in testing, developing and validating their processes.

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Ourplant D1

Modular Machine Concept

The desktop machine OurPlant D1 is the basis for the seamless transition of your products into series production.

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Ourplant XTEC

Modular Machine Concept

The modular design of the OurPlant XTec guarantees adaptation to individual and rapidly changing process requirements.

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Ourplant X3

Modular Machine Concept

Like all micro assembly machines of OurPlant, the OurPlant X3 blue is based on a modular design.

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STABILITY for  Dispensing Applications IN MICRO-ASSEMBLY. 

Do you require more facts and figures about this topic? 

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