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Micro Assembly

3D Assembly

3D assembly makes the highly precise positioning of components on spatial carriers possible. For 3D placing tasks placement heads with two additional tool tilting axes, tiltable circuit carriers and three-dimensional inspection systems are used.
Appropriate machines:

Flip Chip Assembly

Within a flip chip assembly process, the components are turned by 180 ° during the process.
For this task placing and inspection technology, flip-units and subside inspection cameras are additionally used.
Appropriate machines:

Die Bonding

Die bonding is defined by placing one or more chip components (bare die) within one process.
Thereby the components are also partially stacked.
Besides the place- and inspection technology, wafer handling units can be also integrated in the die-bonding process.
Appropriate machines:

Passive Alignment

Passive Alignment is the alignment of components at certain dimensions. Thereby all involved components and substrates are measured with high accuracy during the alignment process and before the assembly.
For Passive Alignment processes 2D and 3D assembly systems with customized algorithms for software and hardware are integrated. Measuring sensors, 3D inspection systems and collimators are used for the alignment task.
Appropriate machines:

Active Alignment

Within the active alignment process components and substrates are aligned with accurarcy during the ongoing assembly by means of live measured values. For Active Alignment processes 2D and 3D assembly systems with customized algorithms for software and hardware are integrated. Measuring sensors, 3D inspection systems and collimators are used for the alignment task.
Appropriate machines:

Micro and Nano Dispensing

Conformal Coating

Within a conformal coating process the component’s surface is entirely or partly coated with a thin protective film. For tasks in the field of conformal coating needle and jet dispensing heads with the patend, volume controlled dispensing method of Häcker Automation are used. Inspection systems that are orientated on two or three dimensions are also of great importance.
Appropriate machines:

Glob Top

Glop top is defined by the compact moulding of assembly groups, individual components or even the smallest component connectors with a protective film. For tasks in field of Glob Top a needle dispensing head with the patend, volume controlled dispensing method of Häcker Automation is used. Inspection systems that are orientated on two or three dimensions are also of great importance. Often this process is supported by a needle heating and a heated substrate support.
Appropriate machines:

Dam and Fill

The dam and fill is a two-phase, compact moulding process for assembled or individual components. As a first step a dam with a highly viscous material is generated. Afterwards its dammed area is filled with low-viscosity material.
For tasks in the field of dam and fill mostly needle dispensing heads with the patend, volume controlled dispensing method of Häcker Automation are used. Inspection systems that are orientated on two or three dimensions are also of great importance.
For the processing of dam and fill material two dispensing systems are needed on one machine. Often this process is supported by a needle heating and a heated substrate support.

 

Appropriate machines:

Underfill

During the Underfill process the dispensing material is dispensed on the lower edges of components.
For this process needle and jet dispensing heads with the patend, volume controlled dispensing method of Häcker Automation are used. Inspection systems that are orientated on two or three dimensions are also of great importance. Often the Underfill process is supported by a needle heating and a heated substrate support.

 

Appropriate machines:

Direct dispensing

The Direct dispensing is a patented method for applying dispensing material to the component’s subside. The material is applied partially or fully structured by transfer printing of dispensing material from a thin film to the component part.
Appropriate machines:

Pin Transfer

During the pin transfer process the dispensing material is applied by means of a stamping tool. The material is provided in a defined amount in a wetting unit. It is transmitted by immersing the stamp. Instead of using a placing tool a placing tool is used.

 

Appropriate machines:

Technology consulting

Perfect solutions for demanding tasks.

Prototype

Staying flexible – is a prerequisite for the development of innovative solutions in microsystems technology. In order to realize our ideas and visions, we have created a our own manufacturing and milling center.
Here 85% mechanical and 70% of the electronic parts, which make up our equipment and systems are manufactured in-house. The high production density enables us to produce prototypes at short notice.
In our application center, the prototypes are tested by our application engineers to incorporate any weaknesses back into the development process. At the end of this iterative process stands a mature standard component for reliable use in the series production.