One of the many options of modules in our systems is the use of a Smarpod for high-precision alignment of substrates and components. This allows manipulation in six degrees of freedom with positioning accuracies less than 10nm. 
To illustrate this, you can see a demonstration process in our linked video.

Process steps shown in the video:

1.   the ceramic substrate is measured at 3 positions with the 3D camera to determine the 3D position of the substrate (0-3 sec).
2.   the Smarpod moves to a correction position to the position determined in step 1 (3-4 sec)
3.   the substrate is measured a second time (4-7 sec)
4.   the Smarpod makes another correction movement (8 sec)
5.   the substrate is measured a third time and the result is found to be good (9-13 sec)
6.   the Smarpod moves to the measuring position for the height measurement of the bond surface (13- 14 sec)
7.   the linear axis with the measuring head of the confocal sensor moves into the measuring position - the exact height of the bond area is measured (15- 16 sec)
8.   the linear axis with the measuring head of the confocal sensor moves back to the rest position (17 - 19 sec)
9.   the smarpod moves back to the position it had reached in the 4th step (19 - 20 sec)
10. the placement head fetches an invisible component from the wafflepack holder (20 - 24 sec)
11. the placement head moves the component over the placement position (24 - 28 sec)
12. the smarpod moves the last millimeter towards the placement head to press on the invisible component in a defined way (29 sec)
13. the placement head puts down the invisible component and moves back to the overtravel height (30 -32 sec)
14. the smarpod moves back to its starting position (33 sec)
15. the process starts again from the beginning