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Placing Systems and Accessories
2D Placing Systems
The 2D placing systems have been developed for the accurate alignment and placement of components and materials. Positions in the working area are approached with high repeatability. Placement of components in large cavities is possible without any difficulty.
3D Placing Systems
The 3D placing systems realise processes that require a highly accurate spatial alignment of components. Precise 3D-movements can be realised through rotating, tilting and linear axes.
Tool changers enable the fast and flexible change of tools during the machining process. The devices have the function of a magazine that provides tools for automatic change.
Tool adapters are used for the fixation of tools. They are the interface between the placing head and the actual machining tool.
Dispensing Systems and Acessories
The dispensing of materials in very deep cavities and spatial circuit carriers are challenges that are solved with needle dispensing. The linear and patented dispensing method developed by Häcker Automation regulates viscosity fluctuations and achieves consistent process results.
To increase dispensing speeds and optimize cycle times Häcker Automation uses the jet dispensing. The dispensing material is applied contactless and without a needle.
Direct Dispensing Unit
During the direct dispensing process fluids are applied at the components’ bottom side flat or textured. Before placing on the substrate or the circuit the component is directly immersed in the corresponding material.
Needle Inspection Unit / NIU
The calibration and cleaning of the dispensing needle has a significant influence on the dispensing results. The Needle Inspection Unit NIU combines the spatial integration of needle inspection and cleaning in one module.
3D Horizontal Inspection Unit / I-H38
I- H38 measures the location of the needle for a precise dispensing result. The exact needle position is determined within seconds, thus a highly precise positioning of the needle during the dispensing process is ensured.
Needle Cleaning Unit / NCU
The NCU releases needles from dispensing materials by using compressed air without any contact. The nozzles are adjustable in distance and direction of air flow.
The Drip Tray is used to hold dripping dispensing material. The running-in phase of the material helps the dispensing head to adjust to the exact dosage.
Smallest contact surfaces and minimal distances between the pads require a minor solder paste application on the circuit carrier. At the same time warmth – sensitive components need to be protected from untargeted energy supply. Taking into account this challenging conditions Häcker Automation GmbH has developed an integrated process solution for selective soldering.
Horizontal Camera (3D)
The horizontal camera is for calibration of dispensing needles and the height measuring of components. The stereoscopic camera system observes the component that has to be inspected from two perspectives. The obtained image data are used for the creation of a 3D profile. This profiles provides information about the surface condition and the spatial position of component edges.
Subside Camera (2D,3D)
The subside camera allows the exact positioning of the component on the substrate. By measuring the pads at the subside of the component the accuracy information are achieved.
Camera Head (2D,3D)
These camera heads are used in processes, which require a true optical 2D or 3D detection of component and substrate surfaces. Error compensation algorithms detect deviations from nominal positions and correct them by readjusting the working heads.
Mechanical Measuring Systems
Top Measuring Probe
The top measuring probe is a working head. This determines the top position or heights of components and substrates.
Bottom Measuring Probe
The bottom measuring probe is a mechanical probe that is mounted in the machine’s working area. During the process it determines the length or height of the components and placing tools that are located at the working head.
The Flood UV is a UV light source that is usually integrated at the output of the conveyor. This is used for exposure and curing of UV-sensitive process materials.
The UV spot is a machining head with LED -based UV lamp. It can expose and harden. UV-sensitive materials during the process flow.
An infrared radiator is integrated in the transport system. It is used to heat substrates.
Universal supports are flat supports for substrates and components. The positioning is done via overlay application.
3D Substrate Support
3D substrate supports hold substrates and components. The parts can be swiveled in at least one axis. The fixation of the substrate is done component specific usually via clamping or vacuum.
Vacuum supports enable the fixation of substrates and components. The positioning solution and vacuum structure depends on the process task. Solutions can be corner bucklers or complex vacuum pick and contours.
Heating Substrate Support
Heating Substrate Supports are heatable surface supports for substrates and components. The positioning is done via overlay application.
Transport System (fixed width)
Automatic conveyor with fixed-configuration transport width.
Transport System (variable width)
Automatic conveyor with variably adjustable transport width.
A wafer handling unit is a unit for the removal of scattered components on wafer films.
A Waffle pack support is a support for components in waffle-pack magazines.
A gel pack support is a holder for components in different gel-pack magazines.
JEDEC Tray Feeder
A JEDEC Tray Feeder is a feeder for components in JEDEC Trays with integrated automatic tray changer.
SMD feeders are feeders and conveyors for SMD components in blister strips ( “Tape & Reel”).
Vibration feeders are feeders for bulk components. This feeder unit is usually adapted to the component.
A Flip Unit is used for the flipping of components during the placing process.