Our idea of diversity for your individual challenge.
Häcker Automation’s placing equipment is designed for precise alignment and placement of components. Positions in the working area are approached with high repeatability. The assembly in large cavities is easily possible with a Z-stroke of 150mm.
Processes that require highly accurate spatial alignment of components are implemented by means of an 3D Placer.Turning, tilting and linear axes realise high precise 3D movements. The heads can be equipped with both, standard and process-specific tools. Vacuum-based component tools as well as stamping tools for pin transfer processes are available.
The Staking Head for the staking of plastic components was developed in order extends the techology range, whcih ensures also the individual adaptation to customer’s process.
Dispensing is one of the core technologies of microsystems technology. A broad range of applications for example the setting of adhesive dots, the application of solder pastes on contact surfaces or the sealing of surfaces with a protective varnish.
As different as the requirement profiles are – the key challenge is precision.
The used dispensing technology has to ensure that small quantities can be applied independently of the flow properties of the dispensing material. In addition, high repeatability is required to ensure consistent results within the process.
Precision also means applying the material in a specific place and in a defined form. Highly compact components require accuracies with a few microns tolerance.
Within this field Häcker Automation has been designing and implementing solutions for dispensing processes in microsystems technology for more than 20 years. The know-how forms the basis for innovative dispensing processes, such as the linear controlled dispensing or direct dispensing with various dispensing modules.
The laser module is a versatile machining head and is used for processes that can not be realised with standard soldering methods.
This is particularly the case with temperature-sensitive and components that require a subsequent contact.
The laser head with infeed axis has an integrated laser source, optics and process control and monitoring technology.
Optionally, this head can also be equipped with an intelligent wire feed.