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Flip chip assembly.

Precise connections.

Assembly and connection technology for complex microelectronics.

Häcker Automation’s flip chip module connects micro-products extremely precisely and raises your production to a new level of quality and performance.
Especially for microelectronics with complex circuits and several thousand contacts, flip-chip assembly often offers the only way to successfully contact the chip and substrate.

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flip chip assembly

Micro assembly shop flip chip.

Find everything for your efficient automation in the micro-assembly shop. A large portfolio of machines and modules is available for your production.
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OURPLANT Pocket
MODULAR MACHINE CONCEPT

The compact OurPlant Pocket realises semi-automated processes and provides developers an excellent support in testing, developing and validating their processes.

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OURPLANT D1
MODULAR MACHINE CONCEPT

The desktop machine OurPlant D1 is the basis for the seamless transition of your products
into series production.

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OURPLANT XTEC
MODULAR MACHINE CONCEPT

The modular design of the OurPlant XTec guarantees adaptation to individual and rapidly changing process requirements.

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OURPLANT X3
MODULAR MACHINE CONCEPT

Like all micro assembly machines of OurPlant, the OurPlant X3 blue is based on a modular design.

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WEBINAR

STABILITY FOR DISPENSING APPLICATIONS IN MICRO-ASSEMBLY.

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WEBINAR on YOUTUBE

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