After dispensing solder paste and placing SMDs on a 3D-MID, the components are soldered using a Laser soldering system. This process can further be applied to a 3D handling as shown in the movie.
The movie shows the Laser soldering on a concave 3D-MID substrate. The camera is mounted within the optical axis of the Laser head. The Laser itself is based on a diode Laser with wavelength of around 970nm. The Laser heats up the solder paste, which was dispensed before placing the component on the substrate. The smoke shows the evaporation of the flux material.