With OurPlant, Häcker Automation has created an open machine platform that allows the
automated mapping of complex and extensive processes in the field of microsystems
technology. The modular machine concept currently includes 4 basic machines, which all
have an identical basic structure and can be flexibly adapted to your process.
With the OurPlant family of machines you can realize every product phase from the
laboratory stage to mass production.
INTERFACES
How are processing heads and modules connected mechanically and electrically?
What possibilities of data logging do the systems offer?
How are two machines electrically connected? – What do you have to consider?
How is gaseous media distributed within the systems?
Answers to these and many other questions can be found here:
THE TROLLEY SYSTEM
With the optional trolley system of the OurPlant X3, you can further increase the flexibility and
versatility of the machine.
This allows you to react quickly to changing product requirements.
The trolleys are integrated in the optional area of the machine’s base plate. Since they have the
pattern of the entire base plate, they can also be equipped with all necessary modules.
For high modules, the height of the respective trolley can be adjusted. The interior of the trolley
offers sufficient space for storing the corresponding control technology.
YOUR TEST LAB
Click here to get to the implementation of your product into automation. In our test
laboratory you can carry out initial tests on our systems or commission a feasibility study.
TECHNOLOGIES
Pick and Place on flat or three-dimensional components, automatic optical inspections (AOI)
of different materials or the joining of two materials by means of pressure and temperature
are only a small part of possible technologies that can be realized in combination in only
one machine.
Here you will find all the necessary technologies and modules to map your complete production process.
2D Assembly
Two dimensional assembly means that the components are positioned with high precision onto flat supports. Placing heads with 360 ° tool rotation axes and inspection systems that orient their self in two or three dimensions are primarily used for 2D assembly tasks.
3D Assembly
3D assembly makes the highly precise positioning of components on spatial carriers possible. For 3D placing tasks placement heads with two additional tool tilting axes, tiltable circuit carriers and three-dimensional inspection systems are used.
Flip Chip Assembly
Within a flip chip assembly process, the components are turned by 180 ° during the process.
For this task placing and inspection technology, flip-units and subside inspection cameras are additionally used.
Die Bonding
Die bonding is defined by placing one or more chip components (bare die) within one process.
Thereby the components are also partially stacked.
Besides the place- and inspection technology, wafer handling units can be also integrated in the die-bonding process.
Passive Alignment
Passive Alignment is the alignment of components at certain dimensions. Thereby all involved components and substrates are measured with high accuracy during the alignment process and before the assembly.
For Passive Alignment processes 2D and 3D assembly systems with customized algorithms for software and hardware are integrated. Measuring sensors, 3D inspection systems and collimators are used for the alignment task.
Active Alignment
Within the active alignment process components and substrates are aligned with accurarcy during the ongoing assembly by means of live measured values. For Active Alignment processes 2D and 3D assembly systems with customized algorithms for software and hardware are integrated. Measuring sensors, 3D inspection systems and collimators are used for the alignment task.
Micro and Nano Dispensing
Pressure-time-controlled Dispensing
The dispenser D-PT is a pressure-time-controlled dispenser that dispenses various materials directly from the cartridge, without an additional valve. A retention vacuum in the cartridge prevents dispensing material from running after. This guarantees precise dispensing results.
Jet Dispensing
During jet dispensing the controlled volume flow is combined with the jet dispensing technology. Since the feed motion of the needle is not necessary during jet dispensing, the dispensing speed is additionally increased and thus optimises the cycle times. An integrated material heating warms the dispensing material up to the optimal temperature to ensure a smooth dispensing process.
Direct dispensing
The Direct dispensing is a patented method for applying dispensing material to the component’s subside. The material is applied partially or fully structured by transfer printing of dispensing material from a thin film to the component part.
Pin Transfer
During the pin transfer process the dispensing material is applied by means of a stamping tool. The material is provided in a defined amount in a wetting unit. It is transmitted by immersing the stamp. Instead of using a placing tool a stamping tool is used.
Practice examples
Component feeding for bulk material via Flex Feeder
For a customer in the sensor industry we have integrated a SmartSight system with Flex Feeder from Asyril into our OurPlant XTec. This feeder system for bulk material detects different components. It determines the component position via Sky Cam on the presentation surface simultaneously to the placement process. This reduces cycle times and thus increases efficiency in the automation process. We have darkened the UV protection screens of our OurPlant XTec to ensure a constant lighting environment.
Click here to watch the video!
Conformal Coating
Within a conformal coating process the component’s surface is entirely or partly coated with a thin protective film. For tasks in the field of conformal coating needle and jet dispensing heads with the patend, volume controlled dispensing method of Häcker Automation are used. Inspection systems that are orientated on two or three dimensions are also of great importance.
Glob Top
Glop top is defined by the compact moulding of assembly groups, individual components or even the smallest component connectors with a protective film. For tasks in field of Glob Top a needle dispensing head with the patend, volume controlled dispensing method of Häcker Automation is used. Inspection systems that are orientated on two or three dimensions are also of great importance. Often this process is supported by a needle heating and a heated substrate support.
Underfill
During the Underfill process the dispensing material is dispensed on the lower edges of components.
For this process needle and jet dispensing heads with the patend, volume controlled dispensing method of Häcker Automation are used. Inspection systems that are orientated on two or three dimensions are also of great importance. Often the Underfill process is supported by a needle heating and a heated substrate support.
Dam and Fill
The dam and fill is a two-phase, compact moulding process for assembled or individual components. As a first step a dam with a highly viscous material is generated. Afterwards its dammed area is filled with low-viscosity material.
For tasks in the field of dam and fill mostly needle dispensing heads with the patend, volume controlled dispensing method of Häcker Automation are used. Inspection systems that are orientated on two or three dimensions are also of great importance.
For the processing of dam and fill material two dispensing systems are needed on one machine. Often this process is supported by a needle heating and a heated substrate support.
