With OurPlant, Häcker Automation has created an open machine platform that allows the
automated mapping of complex and extensive processes in the field of microsystems
technology. The modular machine concept currently includes 4 basic machines, which all
have an identical basic structure and can be flexibly adapted to your process.
With the OurPlant family of machines you can realize every product phase from the
laboratory stage to mass production.
You benefit from a unique machine concept that can be adapted to the increasing specialization and constantly changing requirements for micro products.
This is made possible by standardized interfaces, independent function modules and easy configurability of the OurPlant systems.

2D Assembly

Two dimensional assembly means that the components are positioned with high precision onto flat supports. Placing heads with 360 ° tool rotation axes and inspection systems that orient their self in two or three dimensions are primarily used for 2D assembly tasks.

3D Assembly

3D assembly makes the highly precise positioning of components on spatial carriers possible. For 3D placing tasks placement heads with two additional tool tilting axes, tiltable circuit carriers and three-dimensional inspection systems are used.

Flip Chip Assembly

Within a flip chip assembly process, the components are turned by 180 ° during the process.
For this task placing and inspection technology, flip-units and subside inspection cameras are additionally used.

Die Bonding

Die bonding is defined by placing one or more chip components (bare die) within one process.
Thereby the components are also partially stacked.
Besides the place- and inspection technology, wafer handling units can be also integrated in the die-bonding process.

Passive Alignment

Passive Alignment is the alignment of components at certain dimensions. Thereby all involved components and substrates are measured with high accuracy during the alignment process and before the assembly.
For Passive Alignment processes 2D and 3D assembly systems with customized algorithms for software and hardware are integrated. Measuring sensors, 3D inspection systems and collimators are used for the alignment task.

Active Alignment

Within the active alignment process components and substrates are aligned with accurarcy during the ongoing assembly by means of live measured values. For Active Alignment processes 2D and 3D assembly systems with customized algorithms for software and hardware are integrated. Measuring sensors, 3D inspection systems and collimators are used for the alignment task.

Micro and Nano Dispensing

Pressure-time-controlled Dispensing

The dispenser D-PT is a pressure-time-controlled dispenser that dispenses various materials directly from the cartridge, without an additional valve. A retention vacuum in the cartridge prevents dispensing material from running after. This guarantees precise dispensing results.

Jet Dispensing

During jet dispensing the controlled volume flow is combined with the jet dispensing technology. Since the feed motion of the needle is not necessary during jet dispensing, the dispensing speed is additionally increased and thus optimises the cycle times. An integrated material heating warms the dispensing material up to the optimal temperature to ensure a smooth dispensing process.

Direct dispensing

The Direct dispensing is a patented method for applying dispensing material to the component’s subside. The material is applied partially or fully structured by transfer printing of dispensing material from a thin film to the component part.

Practice examples