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PCB assembly and 3D assembly.

Highly precise and efficient.


Automation systems from Häcker Automation are your equipment to realise diverse process steps.
The precise assembly of printed circuit boards as well as highly sensitive and geometrically demanding components in the micro and nano range have many influencing variables that affect the perfect result. From placement in extremely deep cavities to placement of touch-sensitive components, in our portfolio you will find the clever solution for your individual needs.

3D placement.


One of the many options of modules in our systems is the use of a Smarpod for high-precision alignment of substrates and components. This allows manipulation in six degrees of freedom with positioning accuracies less than 10nm.To illustrate this, you can see a demonstration process in our linked video.

Process steps shown in the video:

1. The ceramic substrate is measured at 3 positions with the 3D camera to determine the 3D position of the substrate (0-3 sec).

2. The Smarpod moves to a correction position to the position determined in step 1 (3-4 sec).

3. The substrate is measured a second time (4-7 sec).

4. The Smarpod makes another correction movement (8 sec).

5. The substrate is measured a third time and the result is found to be good (9-13 sec).

6. The Smarpod moves to the measuring position for the height measurement of the bond surface (13- 14 sec).

7. The linear axis with the measuring head of the confocal sensor moves into the measuring position – the exact height of the bond area is measured (15- 16 sec).

8. The linear axis with the measuring head of the confocal sensor moves back to the rest position (17 – 19 sec).

9. The smarpod moves back to the position it had reached in the 4th step (19 – 20 sec).

10. The placement head fetches an invisible component from the wafflepack holder (20 – 24 sec).

11. The placement head moves the component over the placement position (24 – 28 sec).

12. The smarpod moves the last millimeter towards the placement head to press on the invisible component in a defined way (29 sec).

13. The placement head puts down the invisible component and moves back to the overtravel height (30 -32 sec).

14. The smarpod moves back to its starting position (33 sec).

15. The process starts again from the beginning.

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Take your die bonding process to a whole new level. Increasing product miniaturization and volatile markets are pushing traditional chip processing to its limits. Extensive dispensing equipment is available for applying your preferred bonding material. With the help of bonding tool sets and intelligent placement technology, we guarantee the safe and precise handling of your dies. The entire bonding equipment is based on a modular concept and reusable as well as replaceable.

DIE sorting as a pre-process of die bonding.

At the beginning of the process, the dies/chips are located on a wafer that is clamped in a frame. In order to carry out sorting successfully, it is important to know in which area the needle and the pickup tool are allowed to manipulate the component. Both may only touch the component in this area, otherwise damage may occur and functionality is no longer guaranteed. When ejecting the components, always ensure that no splintering occurs at these points.
For this pickup process, a wafer eject unit (also called die eject unit) as well as suitable needles and rubber or steel tools are used. If sensitive substrate surfaces are involved on which no residues must remain, the use of a steel tool is recommended. Attention must be paid to the parameters while ejecting and picking up, such as approach heights, pick-up heights, needle start heights, exit heights, speed and waiting time. The picked-up parts are then checked for position and fractures using a bottom-side camera, and the good parts are sorted into a feeding system, for example a gel pack or a waffle pack.
Fig. 1: Product on a wafer.

DIE Bonding.

Fig.2: Versuchsaufbau for test setup for DIE Bonding.

Substrate feeding and supply is realized, for example, by means of a boat and a carrier on a vacuum support. Before the actual bonding process, the individual positions on the substrate that are inspected. These positions are used as references for the placement.

The appropriate dispensing material is then applied. In the process example shown, this is done by means of a pin transfer process on the Direct Dispensing Unit.

The wetted chip is then placed on the substrate. Afterwards, an automatic optical inspection of the products is realised.


Flip chip assembly.


Complex electronic circuits are increasingly being implemented as integrated semiconductors. It is effective to provide the inputs and outputs for control signal transmission on the underside of the component in the form of an array. In addition to shorter runtimes, this also offers advantages in terms of heat dissipation. Due to the semiconductor manufacturing process, the conductive tracks of a chip are located on the top side of the wafer. Therefore, it is necessary to flip the components prior to placement. This process is known as flip-chip assembly. Flip-chip assembly systems must ensure exceptional accuracies due to the small distances between the contact pads and their array-shaped arrangement. In addition to positioning in the area (X and Y), rotation about the Z-axis (theta) of the placement head is critical.
Häcker Automation offers an integrated process solution for flip chip assembly. The first process step requires the application of a conductive adhesive or solder paste to the substrate to enable subsequent contacting either by UV light or heat. The flip-chip process itself begins with the ejection of individual wafer chips from a diced wafer mounted on a tape in a frame. Different wafer diameters and chips with different sizes and thicknesses can be used. The ejection system is a fixed component and can be easily replaced when switching to other products. Even highly sensitive and thin dies can be processed. The turning station takes care of turning the component, which can then be placed on the substrate at the desired position. The high-precision gantry system of the VICO basic machine ensures the required placement accuracy. The necessary placement accuracy of better than 10 µm is ensured by the optionally available camera systems and the error correction algorithms in the control software. The semiconductor dies can be placed on the substrate as bare dies or further processed into packages such as BGAs. A flip-chip process solution can be extended with dispensing processes such as glob top, conformal coating or other micro-assembly technologies such as 3D assembly.
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