Production systems for innovative and high-precision die bonding 

With automation systems from Häcker Automation, you have the equipment for the various types of die bonding applications.

Increasing miniaturization is quickly pushing traditional chip connections to their limits. From classic die bonding to thermocompression bonding to ultrasonic bonding, the possibilities are diverse and always tailored to your specific application. Our experts will be happy to advise you!

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Do you want to learn more about Die Bonding and our services? Do you need information on a specific topic? Or do you have an individual question? Then don't hesitate to contact us.

Micro assembly shop DIE bonding. ​​​​​​​

Find everything for your efficient automation in the micro-assembly shop. A large portfolio of machines and modules is available for your production.

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OurPlant Pocket

Modular Machine Concept

The compact OurPlant Pocket realises semi-automated processes and provides developers an excellent support in testing, developing and validating their processes.

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Ourplant D1

Modular Machine Concept

The desktop machine OurPlant D1 is the basis for the seamless transition of your products into series production.

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Ourplant XTEC

Modular Machine Concept

The modular design of the OurPlant XTec guarantees adaptation to individual and rapidly changing process requirements.

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Ourplant X3

Modular Machine Concept

Like all micro assembly machines of OurPlant, the OurPlant X3 blue is based on a modular design.

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STABILITY for  Dispensing Applications IN MICRO-ASSEMBLY. 

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