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DIE BONDING.

Automating high-precision connections.

Production systems for innovative and high-precision die bonding

With automation systems from Häcker Automation, you have the equipment for the various types of die bonding applications.
Increasing miniaturization is quickly pushing traditional chip connections to their limits. From classic die bonding to thermocompression bonding to ultrasonic bonding, the possibilities are diverse and always tailored to your specific application. Our experts will be happy to advise you!
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Micro assembly shop DIE bonding. ​​​​​​​

Find everything for your efficient automation in the micro-assembly shop. A large portfolio of machines and modules is available for your production.
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OURPLANT Pocket
MODULAR MACHINE CONCEPT

The compact OurPlant Pocket realises semi-automated processes and provides developers an excellent support in testing, developing and validating their processes.

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OURPLANT D1
MODULAR MACHINE CONCEPT

The desktop machine OurPlant D1 is the basis for the seamless transition of your products
into series production.

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OURPLANT XTEC
MODULAR MACHINE CONCEPT

The modular design of the OurPlant XTec guarantees adaptation to individual and rapidly changing process requirements.

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OURPLANT X3
MODULAR MACHINE CONCEPT

Like all micro assembly machines of OurPlant, the OurPlant X3 blue is based on a modular design.

TO THE SHOP

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STABILITY FOR DISPENSING APPLICATIONS IN MICRO-ASSEMBLY.

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