The protection of sensible microelectronic components and electrical connections is an essential part of advanced packaging processes in the assembly and interconnect technologies. Glob Top Technology belongs to the demanding processes. Individual components or complete functional assemblies are covered with a material, to be protected against damage through mechanical stress, moisture, radiation or dust. Compared to conformal coating the application of the protective layer is selective and not over a complete area.
The developed solutions for Glob Top processes from Häcker Automation draw their performance out of the high precision of the portal system as well as from the flexibility of the patented dispense method. Therefore the accurate positioning to microns of the dispense needle as well as the precise amount of potting material can be assured.
In addition to the required technical prerequisites for a precise dispense process the selection of the appropriate potting material plays a significant role. Here our partners can rely on the extensive know how of our application team. With the standardized interfaces (SMEMA) the integration into complex assembly lines can easily be implemented.
Technological challenges
Selective coating
Precise positioning of the dispense heads
Amount of dispense material
Selection of the optimal potting material
Selection of the optimal dispense tool
Applications
Glob Top on Wirebond modules (chip on board)
