THIS DIODE LASER CREATES SOLDER CONNECTIONS AT HIGH PROCESS SPEEDS.
In microassembly, there are numerous applications in which a soldering process is crucial for the quality of the components. For example, if they are particularly temperature sensitive, a standard soldering process cannot be used. Selective soldering technology is then a perfect solution.
When it comes to laser soldering, we cooperate with the Mergenthaler company and, depending on customer requirements, integrate a very compact laser soldering system with or without wire feed into our laser systems. This laser is used especially for temperature-sensitive components as well as for components that have to be assembled selectively and for components that require subsequent contacting.
Selective laser soldering is mainly used for processes in the optics, medical technology and automotive industries.
The laser with feed axis has an integrated laser source, optics, and process control and monitoring technology. An integrated pyrometer measures the heat input at the solder joint without contact.
During applications, an integrated protective glass with air curtain protects the laser optics from developing particles and smoke. A ring light ensures optimum illumination of the processing area. To ensure continuous process monitoring, the diode laser is equipped with a digital camera. Another advantage is the automatic storage of all process diagrams.
The compact OurPlant Pocket realises semi-automated processes and provides developers an excellent support in testing, developing and validating their processes.
The desktop machine OurPlant D1 is the basis for the seamless transition of your products
into series production.
The modular design of the OurPlant XTec guarantees adaptation to individual and rapidly changing process requirements.
Like all micro assembly machines of OurPlant, the OurPlant X3 blue is based on a modular design.
