Manufacturers benefit from this efficient and material-saving technology, particularly in the field of high-performance electronics to which the Power Module Assembly is connected. Positive side effects of the special application can be seen here, e.g. in the mechanical and electrical properties that sintering brings with it.
Together with IDC GmbH, we have developed an extremely compact sintering press that covers a wide range of applications with a temperature and force range of 20 ° C – 300 ° and 5N – 10 KN. Since every customer process and its products vary, a handling system for components is integrated in addition to a quick-change system for various tools.
The compact OurPlant Pocket realises semi-automated processes and provides developers an excellent support in testing, developing and validating their processes.
The desktop machine OurPlant D1 is the basis for the seamless transition of your products
into series production.
The modular design of the OurPlant XTec guarantees adaptation to individual and rapidly changing process requirements.
Like all micro assembly machines of OurPlant, the OurPlant X3 blue is based on a modular design.
